This heat-conductive paste is electrically non-conductive, well spreadable, castable, glueable, non-caking and non-bleeding. It ensures best heat transfer between semiconductor and heat sink and eliminates poorly heat-conductive air inclusions between the mounting surfaces.
| Appearance: | pasty |
| base: | silicone oils |
| thermo-conductive components: | metallic oxide |
| Colour: | white |
| Density at 20°C: | 2.10 g / cm3 |
| Temperature range: | -100°C up to +200°C |
| Heat-conductivity: | 0.9 W/mk |
| Weight loss after 96 h / 200°C: | 0.84% |
| Bleeding: | 0.4% |
| Dielectric constant at 106 Hz: | 4.9 |
| Specific resistance: | 1 x 1015 cm |
| Dielectric strength: | 18 kV/mm |
