The high-speed SMT connector MicroSpeed with the pitch 1.0 mm is especially designed for modern board-to-board applications in telecom and datacom equipments. for next gernation sstems with data rates up to 10 GBit/s is this new modular connector system the right solution. MicroSpeed features differential signal transmission with a ijpedance of 100 Ω or single ended signal transmission with a pimedance of 50 Ω. Two different signal contact arrangementes are possible. an excellents signal integrity is achieved ba a design with 2 signal and 2 shield contact rows. The termination area of the shield contacts is available in 2 options: SMT or THR (Thru Hole Reflow).
For fully automatic SMT assembly the connector is provided with tape-and-reel packaging.
Features- Pitch within row: 1.0 mm, Pitch within column: 1.5 mm
- Termination signal contacts: SMT
- Termination ground contacts: SMT or THR
- Board-to-Board heights 5-20 mm
- Pin configurations:
2-row versíons: 50 signal contacts / 18 ground contacts
7-row versions: 133 signal contacts / 14 ground contacts
(available only on request)For rugged application the angled Versions comes along with reinforced side walls and two polarized guide elements for aligment and secure mating.
MOQ = 400 pcs
| Working current: | 1 A |
| Crosstalk: | ≤ 2% at 100 ps |
| Housing material: | LCP |
| Contact: | Copper alloy |
| Contact plating: | Contact area gold plated |
| Termination area tin plated |
| Differential impedance: | 100 Ohms |
| Single ended impedance: | 50 Ohms |
| Packing: | Tape & Reel |
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| Dimensions (mm) | |
